Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab, research center and UFS series

Analysis EMMC162 BGA186 High Stable Socket For IC Design R D Test In Lab Research Center
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Product Description

Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test

Characteristics of eMMC BGA 162/186

Analysis EMMC162 BGA186 high stable socket are as below:

1. Apply to different sizes of eMMC chip of Samsung, Sandisk, Micron,SK hynix etc.

2. Good quality Pogo pins were chosen for stable contact.

3. Materials of Popo pins:

Barrel - phophated bronze

Planger - Beryllium copper

Spring - Piano wire

3. Easy use for different eMMC chip sizes by using suitable guide plate. Normally there are 4 sizes 11.5x13mm, 12x16mm, 12x18mm, 14x18mm.

4. Special PCB adapter for soldering.

5. Simple and quick fixing.

6. Layout of the test socket is LxWxH 34.55mmx28.8mmx30.3mm.

7. Rating current: 0.5A.

KZT eMMC BGA 169 153 analysis test socket, fixture, fixing or soldering socket with soldering plate. Easy to use.

ANDK SOCKETS Partners: SAMSUNG, Hynix, Sandisk, Intel, ASUS, Foxconn, ZTE, Toshiba, Kingston, Lenovo, MSI, Qualcomm, HUAWEI, ACER, TCL, Flextronics, BYD, etc.


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