BGA66 OPEN TOP Burn in socket pitch 1.0mm IC size BGA66(7.47*11.02) 1.0 TP01/50 BGA64 VFBGA64 burn programmer

BGA66 OPEN TOP Burn In Socket Pitch 1 0mm IC Size BGA66 7 47 11 02
  • Seller ANDK-Socket Store
  • List Price US $129.80piece
  • Sale Price US $129.80piece
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Item Specifics

Product Description


BGA66 OPEN TOP Burn in socket pitch 1.0mm IC size 7.47*11.02mm BGA66(7.47*11.02)-1.0-TP01/50 BGA64 VFBGA64 burn in programmer socket Specifications:
Part number:BGA66(7.47*11.02)-1.0-TP01/50N
IC Package:BGA66 , VFBGA66
Pin Pitch:1.0mm
Pin Count:66pins
IC Size:7.47*11.02mm
Material & Performance:
socket Body: PEI
Contacts:Beryllium Copper Alloy
Contact Plating:Gold over Nickel
Operation Force:2.0KG min, the more PINs the greater force.
Contact Resistance:50m max
Dielectric:700V AC for 1 minute
Insulation Resistance:1,000M 700V DC
Max Current Capacity : 1A
Temperature Rating:-55~+175
Life Span 25,000 Times (Mechanical)


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B.BGA socket New creation a.connect with PCB ways Innovation

Welding structure : No need of welding structure:
Way:Fix by welding Way:Fix by 4 screws
Pin length1.83mm Pin length0.25mm
Two structure features:
1.Welding structure :
Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
effort , and once the socket is welded , it cant be recycle ;
2.No need of welding structure :
Adopt innovative screws locking type to fix the sockets and PCBA board , ensure contact is
stable , meantime shorten the assembly time , time-saving and reduce effort , and socket
can be removed from the PCBA board , recycle and reduce test cost ;
b.Connect with IC ways Innovation
1.Open-top/Clamshell structure
2.Accommodates pitch :4/0.5/0.65/0.8/1.0mm
3.Compact size and low Actuation Force
4.Field exchangeable package location plate
5.Ucontact support any type of solder ball shape
Ball\\\\no ball\\\\damaged ball,the drop of contact
surface is more than 0.2mm
C.HD picture to show the detailed product